-Switch Control &Over voltage Protection Circuit to ensure stable output and high load capacity.
-Perfect stability of power device assured by the technology of Glassivation and Chip Back Multi-Layer Metalization.
-Automatic High Precision Chip Mounter and Automatic Embedment Technology to assure perfect consistency of production.
-Advanced circuit design for lower heat release.
-Big inside aluminum substrate for great heat dissipation property.
For more information and models, you can contact the supplier.